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Edge grip type aligner that does not contact the back surface of the 300mm wafer.
■High-precision centering with edge grip method using three movable claws ■Minimizes robot waiting time during alignment with optional buffer port *For more details, please refer to the PDF document or feel free to contact us.
[For 50-300mm wafers] A suction holding aligner that achieves the industry's shortest alignment time.
■Multiple sizes of wafer alignment are possible with the upper command. ■The orifice and notch can be stopped at specified positions (using wafer ID reading). ■Compatible with quartz wafers as well. *For more details, please refer to the PDF document or feel free to contact us.
